Shian Kelin

KM-S · Wafer Drying

KM-S 12-inch wafer supercritical drying system

KM-S dries 8/12-inch wafers and square substrates in a 13-inch-class pressure chamber with an automatic vessel lid.

Wafers / Chamber8/12-inch wafers
13-inch-class high-pressure chamber
Pressure / Temperature0-3500 psi
-30 to 80°C
Clean filtrationBased on wafer-process requirements
Confirm final configuration
InterfacesMES and site systems
Assessed against site requirements
Book a Sample Test 400-009-7890
KM-S 12-inch wafer supercritical drying system
An enclosed wafer system for clean production lines and automation interfaces.
KM-S wafer handling and microstructure-protection diagram
DiagramStructure Protection
KM-S control interface and batch-traceability diagram
Technical DiagramControl Interface
KM-S wafer clean-line application
ApplicationClean Production Line

Technical Specifications

KM-S Technical Specifications

Wafer systems are configured by project. Items marked "per configuration" depend on wafer size, cleanliness class and site interfaces; the formal specification governs. Cycle time is evaluated against line takt time.

KM-S · Specifications
Compatible samples8″ / 12″ wafers; square glass substrates, microsphere arrays and other carriers per project
Sample chamber13″-class high-pressure chamber; depth configured by project
Operating pressure0–3500 psi
Operating temperature−30 ~ 80 °C
Vessel lidAutomatic lifting lid with electric closed-loop motion + high-pressure sealing
Wetted materials316L, confirmed per configuration
Clean filtrationConfigured for wafer-process cleanliness requirements
Data loggingTemperature, pressure, status and alarms; batch traceability
Site interfacesMES and site systems, evaluated by project
KM-S Product Sheet Product Sheet

Wafer Fixtures & Applications

KM-S Wafer Fixtures and Applications

Configure wafer handling, clean fluid paths and automation interfaces for batch drying of 8/12-inch wafers.

KM-S 12-inch wafer basket configurationConfiguration
Fixture 12″ Wafer Basket

A circular vertical basket fits the chamber; wafer count and spacing are customized.

KM-S automatic lid and clamping mechanismConfiguration
Mechanism Automatic Opening and Clamping

Dual rods lift in sync; a circumferential mechanism locks the lid after closure.

KM-S concealed electromechanical integrationConfiguration
System Integrated Internal Modules

Cooling, pressurization and controls are integrated internally, leaving only required external interfaces.

Drying after Wafer Wet CleaningSample Photo
Application Drying after Wafer Wet Cleaning

Damage-minimized drying and structural release after wet processing.

Patterned wafers and bare MEMS cantilever samplesSample Illustration
Application MEMS Cantilever Release

Protect high-aspect-ratio microstructures during batch release.

Clean-line IntegrationApplication Photo
Application Clean-line Integration

For production lines requiring clean filtration and batch traceability.

Engineering Features

Wafer Handling, Clean Flow Paths and System Integration

KM-S automatic vessel lid, clean fluid path and data-interface integration System Integration
  1. Automatic Lifting Vessel Lid

    Electric closed-loop opening and high-pressure sealing reduce operator variability.

  2. Clean Fluid Path

    316L wetted parts and clean filtration protect the wafer-level fluid path.

  3. Batch data traceability

    Recipes, run records and alarm logs support batch comparison and traceability.

  4. Production-line Interface Evaluation

    The automatic lid, alarm records, MES and site-system interfaces are evaluated against project boundaries.

Selection & Preparation

KM-S Selection Questions

Compare chamber sizes, operating ranges and applications →

What sample sizes does the KM-S wafer supercritical drying system support?

KM-S is designed for 8/12-inch wafers and uses a 13-inch-class pressure chamber. Confirm dimensions, thickness, holders and chamber depth for square glass substrates, microsphere arrays and other carriers.

What are the KM-S operating pressure and temperature ranges?

The published ranges are 0–3500 psi and −30–80 °C. Confirm pressure-temperature combinations, sample compatibility and programs against final specifications and process validation.

Can KM-S include clean filtration and MES interfaces?

Clean filtration, 316L wetted materials and MES or site-system interfaces can be evaluated for the wafer process. Confirm filtration grade, protocols and interlock boundaries during engineering.

What information is needed to select a wafer supercritical dryer?

Provide wafer diameter and thickness, batch quantity, holders, current solvent, target morphology, cleanliness requirements and site interfaces. Sample testing can precede final chamber and configuration selection.

Resources KM-S product sheet (in Chinese) Download PDF · 1.1 MB →Read online →
Sample Testing

KM-S Wafer Testing and Process Assessment

Provide wafer samples, structural details and cleanliness requirements. We evaluate fixture loading, exchange paths and the clean fluid path, then report structural-release performance.

Requirements Review Send samples and confirm the plan Process Testing Results and Equipment Recommendations
Book a Sample Test Call 400-009-7890 Email sales@kimax-cpd.com

Test scope and schedule are subject to mutual confirmation.

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